The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of the leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.
The 17th SISPAD conference will be held on September 5-7, 2012.
Location: Sheraton Denver Downtown Hotel, Denver, Colorado, USA.
Abstract Submission Deadline: April 9, 2012.
Final Paper Submission Deadline: July 8, 2012.
Original papers are solicited in the following subject areas:
SISPAD PortalSISPAD is held annually, with the location circulating among Asia, Europe, and the USA. For information on previous SISPAD conferences, please visit: http://www.sispad.org/.