 | Vienna University of Technology Technische Universität Wien September 25-27, 2007 |  |
General Information
The 12th International Conference on Simulation of Semiconductor Devices and Processes (SISPAD) will be held in September 2007 at the TU Wien, Vienna, Austria. Following the tradition of the SISPAD conference series as the leading forum for Technology for Computer-Aided Design (TCAD), this conference provides an opportunity for the presentation and discussion of recent advances in modeling and simulation of semiconductor devices, processes and equipment. The scientific program consists of invited and contributed presentations and a poster session.
General Topic Areas
- Device simulation, including transport in nano-structures
- Models of VLSI device scaling limits, quantum effects, and novel devices
- Process simulation, including both continuum and atomistic approaches
- Equipment, topography, and lithography simulation
- Interconnect modeling and algorithms including noise and parasitic effects
- Compact device modeling for circuit simulation
- Integration of circuit and device simulation
- User interfaces and visualization
- High performance computing, numerical methods and algorithms
- Mesh generation and adaptation
- Simulation of such devices as microsensor and optoelectronics devices
- Benchmarking, calibration, and verification of simulators
Abstracts and Proceedings
A two page abstract should be uploaded to the conference homepage. Postal submission of hardcopies is not acceptable. Authors of accepted papers are requested to submit a four page final paper which will be published in the conference proceedings.
Important Dates
Abstract submission |
| March 2, 2007 | |
Notification of acceptance |
| May 8, 2007 | |
Camera ready copy |
| May 25, 2007 | |
Conference |
| September 25-27, 2007 |
Call for Papers
Companion Workshops
In order to cover important evolving issues in greater depth than possible in the regular conference program, two companion workshops will be offered in conjunction with SISPAD 2007. The workshop programs consist solely of invited talks given by world leading experts on the subject.
Monday, September 24, 2007 |
| |
Friday, September 28, 2007 |
|
Venue
The conference will be held in the Electrical Engineering building of the TU Wien: Gußhausstraße 27-29, A-1040 Vienna, Austria
 |  |
SISPAD receives technical co-sponsorship from the IEEE Electron Devices Society.