Wednesday-Friday, 4-6 September

SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices, processes and equipment for integrated circuits and nanoelectronics.

Wednesday-Friday, 4-6 September 2019

Palazzo di Toppo Wassermann
Università degli Studi di Udine – Udine, Italy

 
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Conference Chair: David Esseni, University of Udine
TPC co-Chair: Pierpaolo Palestri, University of Udine
TPC co-Chair: Denis Rideau, STMicroelectronics, Crolles, France
Workshop and Tutorials Chairman: Francesco Driussi, University of Udine.



Welcome!

For more than twenty years the SISPAD has brought together leading scientists, researchers, and students to share their latest developments in advanced modeling of novel semiconductor devices and fabrication processes.

The University of Udine is proud to host the conference in year 2019.

The conference will have a high-caliber technical program consisting of contributed and invited presentations, and of a poster session. Companion tutorials are planned for September 3, 2019. A pleasant social program will also be arranged.

More details on tutorials, invited speakers and social program will be announced as they become available.

For additional inquiries please contact the conference chairs.

We hope to see you at the University of Udine in the summer of 2019 !

David Esseni (University of Udine), Conference Chair
Pierpaolo Palestri (University of Udine), TPC co-Chair
Denis Rideau (University of Udine), TPC co-Chair

Location

The Toppo Wassermann Palace is the seat of the University of Udine High School which welcomes students of high cultural and scientific profile every year, alongside their normal didactic activities with interdisciplinary training courses, seminars and learning foreign languages.
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International Sponsors