Oregon State University
Technical Committee Chair
Sequoia Design Systems
Technical Committee Members:
A. Asenov, University of Glasgow
M. Duane, National Semiconductor
S. Dunham, University of Washington
K. Fukuda, Oki
N. Goldsman, University of Maryland
T. Grasser, TU Vienna
H. Jaouen, STMicroelectronics
E. Kan, Cornell University
J. Lorenz, Fraunhofer IISB
N. Mori, University of Osaka
C. Mouli, Micron
P. Oldiges, IBM
M. Orlowski, Virginia Tech
Y.-K. Park, Samsung
B. Polsky, Synopsys
M. Rudan, Universita di Bologna
Y.-M. Sheu, TSMC
K. Sonoda, Renesas
M. Stettler, Intel
the sponsorship of the Electron Devices Society of the IEEE, an
international conference on the numerical modeling of semiconductor
devices, processes and equipment for integrated circuits will be held
in San Diego, California, USA from September 9-11, 2009.
meeting provides an opportunity for the presentation and discussion of
recent advances in modeling and simulation of semiconductor devices,
processes and equipment for increased understanding and for
applications to both design and manufacturing. The program consists of
20-minute presentations, with ample time for questions and answers. A
poster session is also planned, which provides for a less formal venue
and allows for more in-depth interactions with the authors. The
presentations will be selected from two-page abstracts of topics which
- All aspects of device
simulation, including transport in nano-structures and next generation
devices such as Fin/tri-gate, UTSOI, and structures using
non-conventional materials, effects of strain on carrier transport,
models of device scaling limits, quantum effects, reliability,
fluctuations, novel nano-scale devices such as QCA, SET, CNT, and
- All aspects of front and
back end process simulation, including both continuum and atomistic
approaches, models for dopant activation and diffusion, oxidation,
silicide growth, interface effects, effects due to stress, nano-scale
fabrication, and design of new materials.
- Equipment, topography,
and lithography simulation.
- Virtual fab
implementations and algorithms for computational lithography.
- Interconnect modeling
and algorithms including noise and parasitic effects.
- Compact device modeling
for circuit simulation, including high frequency and noise modeling.
- Integration of circuit,
device, process simulation with applications to performance modeling of
- User interfaces and
- High performance
computing, advanced numerical methods and algorithms.
- Mesh generation and
- Simulations of new
memory structures such as nanocrystal, phase change, MRAM, and devices
such as microsensors, microactuators, optoelectronics devices, lasers,
and flat panel displays.
- Process and device
simulation for power generation, control and storage including
photovoltaics, power devices, smart power, and other "green
calibration, and verification of simulator models.
for submission of abstracts --
March 6, 2009
abstracts must be submitted by email to email@example.com
(PDF format only) and should include:
1. Title of Paper
2. Name, complete mailing address, and email of first author
3. Names and affiliations of additional authors
will be notified of the Technical Program Committee's decision
by April 24, 2009.