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General Information

The 12th International Conference on Simulation of Semiconductor Devices and Processes (SISPAD) will be held in September 2007 at the TU Wien, Vienna, Austria. Following the tradition of the SISPAD conference series as the leading forum for Technology for Computer-Aided Design (TCAD), this conference provides an opportunity for the presentation and discussion of recent advances in modeling and simulation of semiconductor devices, processes and equipment. The scientific program consists of invited and contributed presentations and a poster session.

General Topic Areas

  • Device simulation, including transport in nano-structures
  • Models of VLSI device scaling limits, quantum effects, and novel devices
  • Process simulation, including both continuum and atomistic approaches
  • Equipment, topography, and lithography simulation
  • Interconnect modeling and algorithms including noise and parasitic effects
  • Compact device modeling for circuit simulation
  • Integration of circuit and device simulation
  • User interfaces and visualization
  • High performance computing, numerical methods and algorithms
  • Mesh generation and adaptation
  • Simulation of such devices as microsensor and optoelectronics devices
  • Benchmarking, calibration, and verification of simulators

Abstracts and Proceedings

A two page abstract should be uploaded to the conference homepage. Postal submission of hardcopies is not acceptable. Authors of accepted papers are requested to submit a four page final paper which will be published in the conference proceedings.

Important Dates

Abstract submission   March 2, 2007  
Notification of acceptance   May 8, 2007  
Camera ready copy   May 25, 2007  
Conference   September 25-27, 2007  

Call for Papers

A4 ( highres | lowres )
letter ( highres | lowres )

Companion Workshops

In order to cover important evolving issues in greater depth than possible in the regular conference program, two companion workshops will be offered in conjunction with SISPAD 2007. The workshop programs consist solely of invited talks given by world leading experts on the subject.

Monday, September 24, 2007     Workshop on Electromigration Reliability
Friday, September 28, 2007   Workshop on Organic Electronics

Venue

The conference will be held in the Electrical Engineering building of the TU Wien: Gußhausstraße 27-29, A-1040 Vienna, Austria

 

September 2007 - TU Wien, Austria

http://www.sispad.org



 

IEEE EDS

SISPAD receives technical co-sponsorship from the IEEE Electron Devices Society.