2015 International Conference on Simulation of
Semiconductor Processes and Devices (SISPAD)
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Sponsors

 

University of Maryland

 

Intel

 

Synopsys

 

CoolCAD Electronics, LLC

 

IBM

 

Micron Technology

 

QuantumWise

 

Technical Sponsor:

IEEE, Technical Sponsor

 

SISPAD 2015 Committees

Organizing Committee

Conference Chair Neil Goldsman (University of Maryland)
Technical Committee Chair Mark Stettler (Intel Corporation)

Honorary Committee

R. Dutton (Stanford University, USA)
S. Selberherr (Technical University of Vienna, Austria)
K. Taniguchi (Osaka University, Japan)

International Steering Committee

A. Asenov (University of Glasgow, UK)
V. Axelrad (Sequoia Design Systems, USA)
N. Goldsman (University of Maryland, USA)
J. Lorenz (FhG Erlangen, Germany)
K. Matsuzawa (Toshiba Corporation, Japan)
N. Mori (Osaka University, Japan)
M. Rudan (University of Bologna, Italy)
K. Sonoda (Renesas Electronics Corp., Japan)
M. Stettler (Intel Corporation, USA)

Technical Program Committee

Akin Akturk (U. of Maryland, College Park) Campbell Millar (Gold Standard Simulations)
Roksana Golizadeh (Intel Corp.) Chandra Mouli (Micron Technology)
Tibor Grasser (Technical U. of Vienna) Victor Moroz (Synopsys)
Tom Herrmann (GLOBALFOUNDRIES) Phil Oldiges (IBM)
Akira Hiroki (Kyoto Inst. of Technology) Frank Register (University of Texas, Austin)
Gerhard Klimeck (Purdue U.) Massimo Rudan (University of Bologna)
Irena Knezevic (U. of Wisconsin) Pankaj Shah (Army Research Laboratory)
Takashi Kurusu (Toshiba) Kenichiro Sonoda (Renesas)
Uihui Kwon (Samsung) Clement Tavernier (ST Microelectronics)
Chung-Kai Lin (TSMC)

Publication Chairs

Z. Dilli (CoolCAD Electronics, LLC)
C. Korman (George Washington University)

Local Activities Committee

Z. Dilli (CoolCAD Electronics, LLC)