17th September 2013
SISPAD 2014 will be held in Yokohama, Japan, between the 9th and 11th September 2014. Further details can be found at the SISPAD 2014 website.
17th September 2013
The standard of presentation at SISPAD 2013 was very high, and after careful consideration by members of the Technical Programme Committee, the following papers were selected for the best paper prizes:
IEEE TCAD Best Paper:
"Full band calculations of low- field mobility in p-type Silicon nanowire MOSFETs"
Neophytos Neophytou, Zlatan Stanojevic, and Hans Kosina (Technical University of Vienna)
IEEE-EDS Scotland Chapter Best Student Paper:
"Unified FinFET Compact Model: Modelling Trapezoidal Triple- Gate FinFETs"
Juan Pablo Duarte, Navid Paydavosi, Sriramkumar Venugopalan, Angada Sachid, and Chenming Hu (University of California, Berkeley)
IEEE SISPAD Best Poster:
"Quasi Self-consistent Monte Carlo Particle Simulations of Local Heating Properties in Nano-scale Gallium Nitride FETs"
Taichi Misawa, Shusuke Oki, and Yuji Awano (Keio University)
3rd July 2013
A pleminary version of the Technical Programme is now available - keep an eye on the site for updates.
24th May 2013
Notifications of Acceptance
Notifications of acceptance have been issued for all of the abstracts submissions based on the results of the review process.
If you submitted an abstract and have not received an email, please contact firstname.lastname@example.org.
30th April 2013
Registration and Accomodation
The review process is now underway, and the SISPAD 2013 organisers aim to start issuing notification of acceptance in the week beginning 20th May.
Registration for SISPAD 2013 is now open - full details can be found via the Registration page and accomodation in Glasgow can now be booked via the Accomodation page, with rooms at special rates available to SISPAD delegates.
28th March 2013
Due to popular demand, the deadline for abstract submssion to SISPAD 2013 has been extended to 12th April (11.59pm UTC)!
4th March 2013
Best Paper Awards
There will be 3 awards at SISPAD 2013:
- Best Student Paper award from IEEE-EDS Scotland Chapter
- IEEE TCAD Best Student Paper
- IEEE SISPAD Best Paper awards
27th February 2013
Abstract Submission Open
The abstract submission site for SISPAD 2013 is now open!
25th February 2013
Invited Speakers Update
Dr Gary Patton will be the opening plenary speaker at SISPAD 2013! Dr Patton is the Vice President of IBM’s Semiconductor Research and Development
Center based in New York, and is responsible for IBM's next generation of SOI and bulk CMOS logic and embedded DRAM technologies.
The complete list of invited speakers can be viewed here.
18th February 2013
Laurence W. Nagel at SISPAD
Laurence W. Nagel will be giving a talk as part of the workshops at SISPAD 2013.
Dr Nagel is one of the fathers of SPICE, the industry standard method for circuit developement and verification whose 40th Anniversary was celebrated in a special issue of IEEE Solid-State Circuits. Dr Nagel was the lead developer for this simulation tool during his time at the University of California in the early 1970s and his subsequent twenty years working at Bell Laboratories cemented his reputation as a world leading expert in circuit simulation and design.
15th February 2013
We are happy to announce the following invited speakers will be delivering plenary talks at SISPAD:
- Jo Finders (ASML)
- Chenming Hu (University of California, Berkeley)
- Gerhard Klimeck (Purdue)
- Cory Weber (Intel)
- Jeff Wu (TSMC)
8th February 2013
SISPAD on Facebook
The SISPAD Facebook page has been launched, which will be regularly updated in the run up to the conference giving you a sample of what you can expect when you come to Glasgow.
15th January 2013
Best Student Paper Award
There will be an award from the IEEE-EDS Scotland Chapter for the Best Student Paper, chosen from those accepted for oral presentation.