SISPAD '03 Conference Committee

Organizing Committee Members

M. Alam, Agere, USA
Giorgio Baccarani, Univ. Bologna, Italy
Tim Cale, RPI, USA
Changhong Dai, Intel, USA
Carlos H. Diaz, TSMC, Taiwan
Michael Duane, Applied Materials, USA
Scott Dunham, Univ. Washington, USA
N. Goldsman, Univ. Maryland, USA
Shirun Ho, Hitachi, Japan
Kiyoshi Ishikawa, Renesas Technology Corporation, Japan
Sanae Ito, Toshiba, Japan
Stephen Jones, Bookham, UK
Edwin C. Kan, Cornell Univ., USA
M. Kimura, Sony, Japan
Zoran Krivokapic, AMD, USA
James B. Kuo, National Taiwan University, Taiwan
Jurgen Lorenz, Fraunhofer Institute, Germany
Karti Mayaram, Oregon State Univ., USA
Chandra Mouli, Micron, USA
Shinji Odanaka, Univ. Osaka, Japan
Marius Orlowski, Motorola, USA
Wim Schoenmaker, IMEC, Belgium
Siegfried Selberherr, TU Vienna, Austria
Gerhard Wachutka, TU Munich, Germany