K. De Meyer

IMEC

Belgium

J. Faricelli

Compaq

USA

M. Law

University of Florida

USA

P. Leon

PetaLogic Corp.

USA

N. Nakayama

STARC

Japan

S. Odanaka

Osaka University

Japan

H. Ryssel

FhG-IIS-B

Germany

D. Tsoukalas

NCSR ‘Demokritos’

Greece

A. Yoshii

Japan Women’s University

Japan

R. Dutton

Stanford University

USA

S. Selberherr

TU Vienna

Austria

K. Taniguchi

Osaka University

Japan

Y. Awano

Fujitsu Lab

Japan

G. Baccarani

University of Bologna

Italy

R. Brunetti

University of Modena

Italy

N. Cowern

Philips

The Netherlands

M. Duane

Applied Materials

USA

S. Dunham

University of Washington

USA

N. Goldsman

University of Maryland

USA

M. Hane            

NEC

Japan

H. Jaouen

ST Microelectronics

France

M. Jaraiz

University of Valladolid

Spain

S. Jones

Marconi Caswell Ltd

UK

J. B. Kuo

University of Waterloo

Canada

P. Leon

PetaLogic Corp.

USA

J. Lorenz

FhG-IIS-B

Germany

M. Miura-Mattausch

Hiroshima University

Japan

W. Molzer

Infineon Technologies

Germany

K. Nishi

SELETE

Japan

P. Oldiges

IBM

USA

M. Profirescu

TU Bucharest

Romania

K. Rahmat

IBM

USA

S. Selberherr

TU Vienna

Austria

W. Shoenmaker

IMEC

Belgium

T. Toyabe

Toyo University

Japan

G. Wachutka

TU Munich

Germany